Author: Thomas Moore
Edition:
Binding: Kindle Edition
ISBN: B005VF06F8
Edition:
Binding: Kindle Edition
ISBN: B005VF06F8
Characterization of Integrated Circuit Packaging Materials
With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Get Characterization of Integrated Circuit Packaging Materials computer books for free.
Readers will find: --General overview of IC package reliability testing --Characterization for the electrical performance of IC packages --Understanding surface characteristics and interfaces for thermal management --Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive Check Characterization of Integrated Circuit Packaging Materials our best computer books for 2013. All books are available in pdf format and downloadable from rapidshare, 4shared, and mediafire.
Characterization of Integrated Circuit Packaging Materials Download
eaders will find: --General overview of IC package reliability testing --Characterization for the electrical performance of IC packages --Understanding surface characteristics and interfaces for thermal management --Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive
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