Saturday 24 December 2011

Materials for Electronic Packaging

Materials for Electronic Packaging
Author: Deborah Chung
Edition: 1
Binding: Hardcover
ISBN: 0750693142



Materials for Electronic Packaging


Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Get Materials for Electronic Packaging computer books for free.
Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Consists of 16 self-contained Check Materials for Electronic Packaging our best computer books for 2013. All books are available in pdf format and downloadable from rapidshare, 4shared, and mediafire.

download

Materials for Electronic Packaging Download


Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Consists of 16 self-contained

Related Computer Books


No comments:

Post a Comment